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table of contents isd iii detailed description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 speech/sound quality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 flash storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 microcontroller interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 voltage inputs (v cca , v ccd ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 ground inputs (v ssa , v ssd ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 non-inverting analog input (ana in+) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 inverting analog input (ana in? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 audio output (aud out) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 slave select (ss ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 master out slave in (mosi) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 master in slave out (miso) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 serial clock (sclk) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 interrupt (int ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 row address clock (rac) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 external clock input (xclk) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 automute feature (am cap) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 serial peripheral interface (spi) description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 message cueing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 power-up sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 spi port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 spi control register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 timing diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 device physical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
isd microtad-16m iv voice solutions in silicon figures, charts, and tables in the isd microtad-16m data sheet figure 1: isd microtad-16m tsop and pdip/soic pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 figure 2: isd microtad-16m ana in modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 figure 3: spi port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 figure 4: spi interface simplified block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 figure 5: timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 figure 6: 8-bit command format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 figure 7: 24-bit command format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 figure 8: playback/record and stop cycle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 figure 9: application example using spi . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 figure 10: application example using microwire . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 figure 11: application example using spi port on microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 figure 12: 28-lead 8x13.4 mm plastic thin small outline package (tsop) type i (e) . . . . . . . . . . . . .18 figure 13: 28-lead 0.600-inch plastic dual inline package (pdip) (p) . . . . . . . . . . . . . . . . . . . . . . . . .19 figure 14: 28-lead 0.300-inch plastic small outline integrated circuit (soic) (s) . . . . . . . . . . . . . . .20 figure 15: isd microtad-16m bonding physical layout (unpackaged die) . . . . . . . . . . . . . . . . . . . .21 table 1: external clock input clocking table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 table 2: opcode summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 table 3: spi control register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 table 4: absolute maximum ratings (packaged parts). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 table 5: operating conditions (packaged parts) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 table 6: dc parameters (packaged parts) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 table 7: ac parameters (packaged parts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 table 8: absolute maximum ratings (die). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 table 9: operating conditions (die) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 table 10: dc parameters (die) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 table 11: ac parameters (die) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 table 12: spi ac parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 table 13: plastic thin small outline package (tsop) type i (e) dimensions. . . . . . . . . . . . . . . . . . . . .18 table 14: plastic dual inline package (pdip) (p) dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 table 15: plastic small outline integrated circuit (soic) (s) dimensions. . . . . . . . . . . . . . . . . . . . . . .20 table 16: isd microtad-16m device pin/pad designations, with respect to die center (mm) . . . .22
isd ?2727 north first street, san jose, ca 95125 ?tel: 408/943-6666 ?fax: 408/544-1787 ?http://www.isd.com may 1999 a winbond company figure: isd microtad-16m block diagram general description the isd microtad-16m chipcorder product pro- vides high-quality, 3-volt, single-chip record/ playback solutions for 16-minute messaging ap- plications which are ideal for telephone answer- ing devices (tads). the cmos-based devices include an on-chip oscillator, antialiasing filter, smoothing filter, automute feature, audio am- plifier, and high density, multilevel flash storage array. the isd microtad-16m is designed to be used in a microprocessor- or microcontroller- based system. address and control are accom- plished through a serial peripheral interface (spi) or microwire serial interface to minimize pin count. recordings are stored in on-chip nonvolatile memory cells, providing zero-power message storage. this unique, single-chip solution is made possible through isd? patented multilevel stor- age technology. voice and audio signals are stored directly into memory in their natural form, providing high-quality, solid-state voice repro- duction. isd microtad-16m single-chip voice record/playback device 16-minute duration preliminary data sheet
isd microtad-16m ii voice solutions in silicon features single-chip voice record/playback solution single +3 volt supply low-power consumption e operating current: i cc play = 15 ma (typical) i cc rec = 25 ma (typical) e standby current: 1 ? (typical) single-chip duration of 16 minutes 4.0 khz sample rate typical band pass filter 1.7 khz high-quality, natural voice/audio reproduction automute feature provides background noise attenuation during periods of silence no algorithm development required microcontroller spi or microwire serial interface fully addressable to handle multiple messages nonvolatile message storage power consumption controlled by spi or microwire control register 100-year message retention (typical) 100k record cycles (typical) on-chip clock source available in die form, pdip, soic, and tsop
isd microtad-16m 1 isd detailed description speech/sound quality the isd microtad-16m chipcorder is offered at 4.0 khz sampling frequency. the speech samples are stored directly into on- chip nonvolatile memory without the digitization and compression associated with other solu- tions. direct analog storage provides a natural sounding reproduction of voice, music, tones, and sound effects not available with most solid- state solutions. flash storage one of the benefits of isd? chipcorder technolo- gy is the use of on-chip nonvolatile memory, which provides zero-power message storage. the mes- sage is retained for up to 100 years (typically) without power. in addition, the device can be re-recorded (typically) over 100,000 times. microcontroller interface a four-wire (sclk, mosi, miso, ss ) spi interface is provided for isd microtad-16m control and ad- dressing functions. the isd microtad-16m is con- figured to operate as a peripheral slave device, with a microcontroller-based spi bus interface. read/write access to all the internal registers oc- curs through this spi interface. an interrupt signal (int ) and internal read-only status register are provided for handshake purposes. programming the isd microtad-16m is also ideal for playback- only applications, where single or multiple mes- sage playback is controlled through the spi port. once the desired message configuration is creat- ed, duplicates can easily be generated via an isd programmer or a 3rd party programmer. pin descriptions voltage inputs (v cca , v ccd ) to minimize noise, the analog and digital circuits in the isd microtad-16m device use separate pow- er busses. these +3 v busses are brought out to separate pins and should be tied together as close to the supply as possible. in addition, these supplies should be decoupled as close to the package as possible. ground inputs (v ssa , v ssd ) the isd microtad-16m utilizes separate analog and digital ground busses. the analog ground (v ssa ) pins should be tied together as close to the package as possible and connected through a low-impedance path to power supply ground. the digital ground (v ssd ) pin should be connected through a separate low-impedance path to power supply ground. these ground paths should be large enough to ensure that the impedance between the v ssa pins and the v ssd pin is less than 3 w . the backside of the die is con- nected to v ss through the substrate resistance. in a chip-on-board design, the die attach area must be connected to v ss or left floating.
isd microtad-16m 2 voice solutions in silicon figure 2: isd microtad-16m ana in modes figure 1: isd microtad-16m tsop and pdip/soic pinouts 28-pin tsop ana in+ ana in nc int xclk v ccd sclk ss mosi miso v ssa nc v ssa 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 nc rac v cca nc nc nc am cap nc aud out nc v ssd nc nc nc isd4004 v ssa pdip/soic nc v ccd int v ssd v ssa nc nc nc ana in+ nc v ssa aud out am cap 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 sclk ss xclk mosi miso rac v ssa nc nc v cca nc nc nc isd4004 ana in nc
isd microtad-16m 3 isd non-inverting analog input (ana in+) this pin is the non-inverting analog input that transfers the signal to the device for recording. the analog input amplifier can be driven single ended or differentially. in the single-ended input mode, a 32 mvp-p (peak-to-peak) maximum sig- nal should be capacitively connected to this pin for optimal signal quality. this capacitor value, together with the 3 k w input impedance of ana in+, is selected to give cutoff at the low frequen- cy end of the voice passband. in the differential- input mode, the maximum input signal at ana in+ should be 16 mvp-p for optimal signal quali- ty. the circuit connections for the two modes are shown in figure 2 on page 2. inverting analog input (ana in? this pin is the inverting analog input that transfers the signal to the device for recording in the dif- ferential-input mode. in this differential-input mode, a 16 mvp-p maximum input signal at ana in?should be capacitively coupled to this pin for optimal signal quality as shown in the isd microtad-16m ana in modes, figure 2. this ca- pacitor value should be equal to the coupling capacitor used on the ana in+ pin. the input im- pedance at ana in?is nominally 56 k w . in the sin- gle-ended mode, ana in?should be capacitively coupled to v ssa through a capaci- tor equal to that used on the ana in+ input. audio output (aud out) this pin provides the audio output to the user. it is capable of driving a 5 k w impedance. it is recommended that this pin be ac coupled. note the audout pin is always at 1.2 volts when the device is powered up. when in play- back, the output buffer connected to this pin can drive a load as small as 5 k w . when in record, a resistor connects audout to the internal 1.2 volt analog ground supply. this resistor is approximately 850 k w . this rel- atively high impedance allows this pin to be connected to an audio bus without loading it down. slave select (ss ) this input, when low, will select the isd mi- crotad-16m device. master out slave in (mosi) this is the serial input to the isd microtad-16m device. the master microcontroller places data on the mosi line one half-cycle before the rising clock edge to be clocked in by the isd micro- tad-16m device. master in slave out (miso) this is the serial output of the isd microtad-16m device. this output goes into a high-impedance state if the device is not selected. serial clock (sclk) this is the clock input to the isd microtad-16m. it is generated by the master device (microcon- troller) and is used to synchronize data transfers in and out of the device through the miso and mosi lines. data is latched into the isd microtad- 16m on the rising edge of sclk and shifted out of the device on the falling edge of sclk. interrupt (int ) the isd microtad-16m interrupt pin goes low and stays low when an overflow (ovf) or end of message (eom) marker is detected. this is an open drain output pin. each operation that ends in an eom or overflow will generate an interrupt including the message cueing cycles. the inter- rupt will be cleared the next time an spi cycle is initiated. the interrupt status can be read by an rint instruction. overflow flag (ovf) ?he overflow flag indi- cates that the end of the isd microtad-16m? analog memory has been reached during a record or playback operation. end of message (eom) ?he end-of-message flag is set only during playback operation when an eom is found. there are eight eom flag posi- tion options per row.
isd microtad-16m 4 voice solutions in silicon row address clock (rac) this is an open drain output pin that provides a signal with a 400 ms period at the 4 khz sampling frequency. (this represents a single row of memo- ry and there are 2400 rows of memory in the isd microtad-16m devices.) this signal stays high for 350 ms and stays low for 50 ms when it reaches the end of a row. the rac pin stays high for 218.76 m sec and stays low for 31.26 m sec in message cueing mode (see page 5 for a more detailed description of message cueing). refer to the ac parameters table for rac timing information on other sam- ple rate products. when a record command is first initiated, the rac pin remains high for an extra t raclo period. this is due to the need to load sample and hold circuits internal to the device. this pin can be used for message management techniques. external clock input (xclk) the external clock input for the isd microtad- 16m product has an internal pull-down device. these products are configured at the factory with an internal sampling clock frequency cen- tered to ? percent of specification. the fre- quency is then maintained to a variation over the entire commercial temperature and oper- ating voltage ranges as defined by the min- imum/maximum limits in the applicable ac parameters table. the internal clock has a toler- ance, over the extended temperature, industrial temperature and voltage ranges as defined by the minimum/maximum limits in the applicable ac parameters table. a regulated power supply is recommended for industrial temperature range parts. if greater precision is required, the device can be clocked through the xclk pin in table 1. this recommended clock rate should not be var- ied because the antialiasing and smoothing filters are fixed. thus, aliasing problems can occur if the sample rate differs from the one recommended. the duty cycle on the input clock is not critical, as the clock is immediately divided by two inter- nally. if the xclk is not used, this input should be connected to ground. automute feature (am cap) this pin is used in controlling the automute fea- ture. the automute feature attenuates the signal when it drops below an internally set threshold. this helps to eliminate noise (with 6 db of attenu- ation) when there is no signal (i.e., during periods of silence). a 1 m f capacitor to ground should be connected to the am cap pin. this capacitor becomes a part of an internal peak detector which senses the signal amplitude (peak). this peak level is compared to an internally set threshold to determine the automute trip point. for large signals the automute attenuation is set to 0 db while 6 db of attenuation occurs for silence. the 1 m f capacitor also affects the rate at which the automute feature changes with the signal amplitude (or the attack time). the auto- mute feature can be disabled by connecting the am cap pin to v cca . t rac row (400 ms) rac 50 ms t raclo table 1: external clock input clocking table part number sample rate required clock isd microtad-16m 4.0 khz 512 khz
isd microtad-16m 5 isd serial peripheral interface (spi) description the isd microtad-16m operates from an spi serial interface. the spi interface operates with the fol- lowing protocol. the data transfer protocol assumes that the mi- crocontroller? spi shift registers are clocked on the falling edge of the sclk. with the isd micro- tad-16m, data is clocked in on the mosi pin on the rising clock edge. data is clocked out on the miso pin on the falling clock edge. 1. all serial data transfers begin with the fall- ing edge of ss pin. 2. ss is held low during all serial communica- tions and held high between instructions. 3. data is clocked in on the rising clock edge and data is clocked out on the falling clock edge. 4. play and record operations are initiated by enabling the device by asserting the ss pin low, shifting in an opcode and an address field to the isd microtad-16m de- vice (refer to the opcode summary on the page 6). 5. the opcodes and address fields are as fol- lows: <8 control bits> and <16 address bits>. 6. each operation that ends in an eom or overflow will generate an interrupt, in- cluding the message cueing cycles. the interrupt will be cleared the next time an spi cycle is initiated. 7. as interrupt data is shifted out of the isd microtad-16m miso pin, control and ad- dress data is simultaneously being shifted into the mosi pin. care should be taken such that the data shifted in is compatible with current system operation. it is possible to read interrupt data and start a new op- eration within the same spi cycle. 8. an operation begins with the run bit set and ends with the run bit reset. 9. all operations begin with the rising edge of ss . message cueing message cueing allows the user to skip through messages, without knowing the actual physical location of the message. this operation is used during playback. in this mode, the messages are skipped 1600 times faster than in normal play- back mode. it will stop when an eom marker is reached. then, the internal address counter will point to the next message. if you are utilizing the message cueing com- mand, you must perform the following message cueing procedure to ensure proper message cueing for the microtad product. failure to fol- low this procedure may result in inaccurate mes- sage cueing. procedure for proper message cueing: a single ?ummy?stop command must be sent to the device before executing a message cue- ing (mc) or set message cueing (set mc) in- struction. the ?ummy?stop instruction consists of a com- mand with control bits set as follows: run bit = 0 play/record bit = 0 pu bit = 1 iab bit = 1 mc bit = 0 that is, a hex ?0?is shifted into the device as a command. one or more mc or set mc commands may be executed following this command. it is not nec- essary to repeat the ?ummy?stop command until after a subsequent playback operation.
isd microtad-16m 6 voice solutions in silicon 1. message cueing can be selected only at the beginning of a play operation. 2. as the interrupt data is shifted out of the isd microtad-16m, control and address data is being shifted in. care should be taken such that the data shifted in is compatible with current system operation. it is possible to read interrupt data and start a new operation at the same time. see figure 5 through figure 8 for opcode format. power-up sequence the isd microtad-16m will be ready for an oper- ation after t pud (50 ms approximately for 4 khz sample rate). the user needs to wait t pud before is- suing an operational command. for example, to play from address 00 the following programing cycle should be used. playback mode 1. send powerup command. 2. wait t pud (power-up delay). 3. send setplay command with address 00. 4. send play command. the device will start playback at address 00 and it will generate an interrupt when an eom is reached. it will then stop playback. record mode 1. send powerup command. 2. wait t pud (power-up delay). 3. send powerup command. 4. send setrec command with address 00. 5. send rec command. the device will start recording at address 00 and it will generate an interrupt when an overflow is reached (end of memory array). it will then stop recording. table 2: opcode summary instruction opcode <8 bits> address <16 bits> operational summary powerup 00100xxx power-up: device will be ready for an operation after t pud . setplay 11100xxx initiates playback from address . play 11110xxx playback from the current address (until eom or ovf). setrec 10100xxx initiates a record operation from address . rec 10110xxx records from current address until ovf is reached. setmc 11101xxx initiates message cueing (mc) from address . mc 1 11111xxx performs a message cue. proceeds to the end of the current message (eom) or enters ovf condition if no more messages are present. stop 0x110xxx stops current operation. stoppwrdn 0x01xxxx stops current operation and enters stand-by (power-down) mode. rint 2 0x110xxx read interrupt status bits: over?w and eom.
isd microtad-16m 7 isd spi port the following diagram describes the spi port and the control bits associated with it. figure 3: spi port spi control register the spi control register provides control of individual device functions such as play, record, message cueing, power-up and power-down, start and stop operations, and ignore address pointers. table 3: spi control register control register bit device function control register bit device function run enable or disable an operation pu master power control = = 1 0 start stop = = 1 0 power-up power-down p/r selects play or record operation iab ignore address control bit = = 1 0 play record = = 1 0 ignore input address register (a15?0) use the input address register contents for an operation (a15?0) mc enable or disable message cueing p15?0 output of the row pointer register = = 1 0 enable message cueing disable message cueing a15?0 input address register
isd microtad-16m 8 voice solutions in silicon figure 4: spi interface simplified block diagram 1. stresses above those listed may cause permanent damage to the device. exposure to the absolute maximum ratings may affect device reliability. functional operation is not implied at these conditions. table 4: absolute maximum ratings (packaged parts) (1) condition value junction temperature 150? storage temperature range ?5? to +150? voltage applied to any pin (v ss ?0.3 v) to (v cc + 0.3 v) voltage applied to any pin (input current limited to ?0 ma) (v ss ?1.0 v) to (v cc + 1.0 v) lead temperature (soldering ?10 seconds) 300? v cc ?v ss ?.3 v to +7.0 v 1. v cc = v cca = v ccd. 2. v ss = v ssa = v ssd . table 5: operating conditions (packaged parts) condition value consumer operating temperature range 0? to +50? supply voltage (v cc ) (1) +2.85 v to +3.15 v ground voltage (v ss ) (2) 0 v
isd microtad-16m 9 isd 1. typical values: t a = 25? and 3.0 v. 2. all min/max limits are guaranteed by isd via electrical testing or characterization. not all specifications are 100 percent tested. 3. v cca and v ccd connected together. 4. ss = v cca = v ccd , xclk = mosi = v ssa = v ssd and all other pins floating. 5. measured with automute feature disabled. table 6: dc parameters (packaged parts) symbol parameters min (2) typ (1) max (2) units conditions v il input low voltage v cc x 0.2 v v ih input high voltage v cc x 0.8 v v ol output low voltage 0.4 v i ol = 10 ? v ol1 rac, int output low voltage 0.4 v i ol = 1 ma v oh output high voltage v cc ?0.4 v i oh = ?0 ? i cc v cc current (operating) ?playback ?record 15 25 30 40 ma ma r ext = (3) r ext = (3) i sb v cc current (standby) 1 10 a (3) (4) i il input leakage current ? ? i hz miso tristate current 1 10 a r ext output load impedance 5 k w r ana in+ ana in+ input resistance 2.2 3.0 3.8 k w r ana in ana in?input resistance 40 56 71 k w a arp ana in+ or ana in?to aud out gain 25 db (5)
isd microtad-16m 10 voice solutions in silicon 1. typical values: t a = 25? and 3.0 v. 2. all min/max limits are guaranteed by isd via electrical testing or characterization. not all specifications are 100 percent tested. 3. low-frequency cut off depends upon the value of external capacitors (see pin descriptions). 4. single-ended input mode. in the differential input mode, v in maximum for ana in+ and ana in?is 16mvp-p. 5. for greater stability, an external clock can be utilized (see pin descriptions). 6. filter specification applies to the antialiasing filter and the smoothing filter. therefore, from input to output, expect a 6db drop by nature of passing through both filters. 7. the typical output voltage will be approximately 570mvp-p with v in at 32mvp-p. 8. for optimal signal quality, this maximum limit is recommended. 9. when a record command is sent, t rac = t rac + t raclo on the first row addressed. table 7: ac parameters (packaged parts) symbol characteristic min (2) typ (1) max (2) units conditions f s sampling frequency 4.0 khz (5) f cf filter pass band 1.7 khz 3-db roll-off point (3) (7) t rec record duration 16 min (6) t play playback duration 16 min t pud power-up delay 50 msec t stop or t pause stop or pause in record or play 100 msec t rac rac clock period 400 msec (9) t raclo rac clock low time 50 msec t racm rac clock period in message cueing mode 250 ?ec t racml rac clock low time in message cueing mode 31.25 ?ec thd total harmonic distortion 1 2 % @ 1 khz v in ana in input voltage 32 mv peak-to-peak (4) (7) (8)
isd microtad-16m 11 isd 1. stresses above those listed may cause permanent damage to the device. exposure to the absolute maximum ratings may affect device reliability. functional operation is not implied at these conditions. 1. case temp 2. v cc = v cca = v ccd 3. v ss = v ssa = v ssd . 1. typical values: t a = 25? and 3.0 v. 2. all min/max limits are guaranteed by isd via electrical testing or characterization. not all specifications are 100 percent tested. 3. v cca and v ccd connected together. 4. ss = v cca = v ccd , xclk = mosi = v ssa = v ssd and all other pins floating. 5. measured with automute feature disabled. table 8: absolute maximum ratings (die) (1) condition value junction temperature 150? storage temperature range ?5? to +150? voltage applied to any pad (v ss ?0.3 v) to (v cc + 0.3 v) voltage applied to any pad (input current limited to ?0 ma) (v ss ?1.0 v) to (v cc + 1.0 v) v cc ?v ss ?.3 v to +7.0 v table 9: operating conditions (die) condition value consumer operating temperature range (1) 0? to +50? supply voltage (v cc ) (2) +2.85 v to +3.15 v ground voltage (v ss ) (3) 0 v table 10: dc parameters (die) symbol parameters min (2) typ (1) max (2) units conditions v il input low voltage v cc x 0.2 v v ih input high voltage v cc x 0.8 v v ol output low voltage 0.4 v i ol = 10 ? v ol1 rac, int output low voltage 0.4 v i ol = 1 ma v oh output high voltage v cc ?0.4 v i oh = ?0 ? i cc v cc current (operating) ?playback ?record 15 25 30 40 ma ma r ext = (3) r ext = (3) i sb v cc current (standby) 1 10 a (3) (4) i il input leakage current ? ? i hz miso tristate current 1 10 a r ext output load impedance 5 k w r ana in+ ana in+ input resistance 2.2 3.0 3.8 k w r ana in ana in?input resistance 40 56 71 k w a arp ana in+ or ana in?to audout gain 25 db (5)
isd microtad-16m 12 voice solutions in silicon 1. typical values: t a = 25? and 3.0 v. 2. all min/max limits are guaranteed by isd via electrical testing or characterization. not all specifications are 100 percent tested. 3. low-frequency cut off depends upon the value of external capacitors (see pin descriptions). 4. single-ended input mode. in the differential input mode, v in maximum for ana in+ and ana in?is 16 mv peak-to-peak. 5. for greater stability, an external clock can be utilized (see pin descriptions). 6. filter specification applies to the antialiasing filter and to the smoothing filter. 7. the typical output voltage will be approximately 570 mv peak-to-peak with v in at 32 mv peak-to-peak. 8. for optimal signal quality, this maximum limit is recommended. 9. when a record command is sent, t rac = t rac + t raclo on the first row addressed. table 11: ac parameters (die) symbol characteristic min (2) typ (1) max (2) units conditions f s sampling frequency 4.0 khz (5) f cf filter pass band 1.7 khz 3db roll-off point (3) (6) t rec record duration 16 min (5) t play playback duration 16 min (5) t pud power-up delay 50 msec t stop or t pause stop or pause in record or play 100 msec t rac rac clock period 400 msec (9) t raclo rac clock low time 50 msec t racm rac clock period in message cueing mode 250 m sec t racml rac clock low time in message cueing mode 31.25 m sec thd total harmonic distortion 1 2 % @ 1 khz v in ana in input voltage 32 mv peak-to-peak (4) (7) (8)
isd microtad-16m 13 isd 1. typical values: t a = 25? and 3.0 v. timing measured at 50 percent of the v cc level. 2. tristate test condition. table 12: spi ac parameters 1 symbol characteristics min max units conditions t sss ss setup time 500 nsec t ssh ss hold time 500 nsec t dis data in setup time 200 nsec t dih data in hold time 200 nsec t pd output delay 500 nsec t df (2) output delay to hi z 500 nsec t ssmin ss high 1 m sec t sckhi sclk high time 400 nsec t scklow sclk low time 400 nsec f 0 clk frequency 1,000 khz
isd microtad-16m 14 voice solutions in silicon timing diagrams figure 5: timing diagram figure 6: 8-bit command format x x x c0 c2 p5 p4 p3 p2 p1 p0 eom ovf ss sclk mosi miso c4 c3 c1 (1)
isd microtad-16m 15 isd figure 7: 24-bit command format figure 8: playback/record and stop cycle ss mosi miso a6 a7 a8 a9 a10 a11 a12 a13 a14 a15 x x x c0 c1 c2 c3 c4 a0 a1 a2 a3 a4 a5 p4 p5 p6 p7 p8 p9 ovf eom p0 p1 p2 p3 p10 sclk byte 1 byte 2 byte 3 p11 p12 p13 p14 p15 xxxxxx
isd microtad-16m 16 voice solutions in silicon figure 9: application example using spi (1) 1. this application example is for illustration purposes only. isd makes no representation or warranty that such application will be suitable for production. 2. please make sure the bypass capacitor, c2 is as close as possible to the package. 3 2 4 5 1 j1 line out r2 1m c5 1 f r1 10k r3 100 r4 100k pot 3 1 2 11 gain-out v01 v02 v dd gnd gnd gnd gnd gnd ?in +in bypass hp-in1 hp-in2 hpsense shutdown lm4860m audio amplifier u 3 10 15 12 1 4 8 9 16 2 3 7 6 5 14 13 c6 1 f c7 .1 f 3 2 4 5 1 j4 ext speaker 14 13 3 2 28 1 16 17 24 25 26 aud out am cap miso mosi sclk ss ana in ana in+ rac int xclk u 1 isd microtad-16m c11 0.1 f c10 0.1 f v cc r6 47kw pa 0 tcmp pc6 pc0 tcap pd4/sck pd3/mosi pd2/miso pd1/td0 30 31 32 33 28 38 37 35 11 osc2 68hc705c8p u 2 pd0/rdi 29 pd5/ss 34 pc5 pc4 pc3 pc2 26 25 24 23 pc1 27 22 pb2 pb1 pb0 12 13 14 pc7 21 pb3 15 pa 4 pa 3 pa 2 9 8 7 pa 1 10 osc1 39 c8 15?25pf r7 10kw c9 15?30pf reset 1 irq 2 pb6 pb5 pb4 16 17 18 pb7 19 pa 5 6 pa 7 4 pa 6 5 pd7 v cc r5 47kw c4 1 f c1 22 f v cc 11 12 23 4 18 27 v cca v ccd v ssd v ssa v ssa v ssa c3 0.1 f c2 0.1 f 4.096 mhz
isd microtad-16m 17 isd figure 10: application example using microwire (1) 1. this application example is for illustration purposes only. isd makes no representation or warranty that such application will be suitable for production. 2. please make sure the bypass capacitor, c2 is as close as possible to the package. figure 11: application example using spi port on microcontroller (1) 1. this application example is for illustration purposes only. isd makes no representation or warranty that such application will be suitable for production. 2. please make sure the bypass capacitor, c2 is as close as possible to the package. 3 2 4 5 1 j1 line out r2 1m c5 1 f c4 1 f r1 10k r3 100 r4 100k pot 3 1 2 11 gain-out v01 v02 v dd gnd gnd gnd gnd gnd ?in +in bypass hp-in1 hp-in2 hpsense shutdown lm4860m audio amplifier u 3 10 15 12 1 4 8 9 16 2 3 7 6 5 14 13 c6 1 f c7 .1 f 3 2 4 5 1 j4 ext speaker 14 13 3 2 28 1 16 17 24 25 26 aud out am cap miso mosi sclk ss ana in? ana in+ rac int xclk u 1 r5 4.7kw r6 4.7kw v cc c9 0.1 f c8 0.1 f v cc v cc c10 82pf r7 3.3kw cli v cc l6 int reset g3 d0 d1 d2 21 20 19 28 25 23 24 6 5 gnd cop 820c u 2 d3 22 g2 27 g1 26 l7 so g7 sk 2 4 1 18 si 3 17 l1 l2 l3 l4 15 14 13 12 l5 16 l0 11 13 12 11 8 9 10 10 7 isd microtad-16m c1 22 f v cc 11 12 23 4 18 27 v cca v ccd v ssd v ssa v ssa v ssa c3 0.1 f c2 0.1 f 3 2 4 5 1 j1 line out r2 1m c5 1 f c4 1 f r1 10k r3 100 r4 100k pot 3 1 2 11 gain-out v01 v02 v dd gnd gnd gnd gnd gnd ?in +in bypass hp-in1 hp-in2 hpsense shutdown lm4860m audio amplifier u 3 10 15 12 1 4 8 9 16 2 3 7 6 5 14 13 c6 1 f c7 .1 f 3 2 4 5 1 j4 ext speaker 14 13 3 2 28 1 16 17 24 25 26 aud out am cap miso mosi sclk ss ana in? ana in+ rac int xclk r5 4.7kw r6 4.7kw v cc c9 0.1 f c8 0.1 f v cc v cc c10 r7 v dd rb0 mclr ra5 rc3 rc5 rc4 15 14 7 21 8 1 20 v ss pic16c62a u 2 rc0 11 osc1 9 v ss 16 19 isd microtad-16m c1 22 f v cc 11 12 23 4 18 27 v cca v ccd v ssd v ssa v ssa v ssa c3 0.1 f c2 0.1 f u 1
isd microtad-16m 18 voice solutions in silicon device physical dimensions figure 12: 28-lead 8x13.4 mm plastic thin small outline package (tsop) type i (e) note: lead coplanarity to be within 0.004 inches. table 13: plastic thin small outline package (tsop) type i (e) dimensions inches millimeters min nom max min nom max a 0.520 0.528 0.535 13.20 13.40 13.60 b 0.461 0.465 0.469 11.70 11.80 11.90 c 0.311 0.315 0.319 7.90 8.00 8.10 d 0.002 0.006 0.05 0.15 e 0.007 0.009 0.011 0.17 0.22 0.27 f 0.0217 0.55 g 0.037 0.039 0.041 0.95 1.00 1.05 h0????? i 0.020 0.022 0.028 0.50 0.55 0.70 j 0.004 0.008 0.10 0.21
isd microtad-16m 19 isd figure 13: 28-lead 0.600-inch plastic dual inline package (pdip) (p) table 14: plastic dual inline package (pdip) (p) dimensions inches millimeters min nom max min nom max a 1.445 1.450 1.455 36.70 36.83 36.96 b1 0.150 3.81 b2 0.065 0.070 0.075 1.65 1.78 1.91 c1 0.600 0.625 15.24 15.88 c2 0.530 0.540 0.550 13.46 13.72 13.97 d 0.19 4.83 d1 0.015 0.38 e 0.125 0.135 3.18 3.43 f 0.015 0.018 0.022 0.38 0.46 0.56 g 0.055 0.060 0.065 1.40 1.52 1.65 h 0.100 2.54 j 0.008 0.010 0.012 0.20 0.25 0.30 s 0.070 0.075 0.080 1.78 1.91 2.03 q 0 15 0 15
isd microtad-16m 20 voice solutions in silicon figure 14: 28-lead 0.300-inch plastic small outline integrated circuit (soic) (s) note: lead coplanarity to be within 0.004 inches. table 15: plastic small outline integrated circuit (soic) (s) dimensions inches millimeters min nom max min nom max a 0.701 0.706 0.711 17.81 17.93 18.06 b 0.097 0.101 0.104 2.46 2.56 2.64 c 0.292 0.296 0.299 7.42 7.52 7.59 d 0.005 0.009 0.0115 0.127 0.22 0.29 e 0.014 0.016 0.019 0.35 0.41 0.48 f 0.050 1.27 g 0.400 0.406 0.410 10.16 10.31 10.41 h 0.024 0.032 0.040 0.61 0.81 1.02
isd microtad-16m 21 isd figure 15: isd microtad-16m bonding physical layout 1 (unpackaged die) 1. the backside of die is internally connected to v ss . it must not be connected to any other potential or damage may occur. 2. double bond recommended. 3. this figure reflects the current die thickness. please contact isd as this thickness may change in the future. isd microtad-16m i. die dimensions x: 4230 microns y: 9780 microns i. die thickness (3) 11.5 ?.5 mils i. pad opening (min) 90 x 90 microns 3.5 x 3.5 mils v ccd1 v ssa aud out am cap ana in int v ssa xclk v ccd2 ss mosi miso v ssd2 v ssd1 isd microtad-16m rac sclk v ssa (2) ana in+ v cca (2)
isd microtad-16m 22 voice solutions in silicon 1. double bond recommended. table 1: isd microtad-16m device pin/pad designations, with respect to die center (?) pin pin name x axis y axis v ssa v ss analog power supply ?898.1 ?622.4 v ssa v ss analog power supply ?599.9 ?622.4 aud out audio output 281.9 ?622.4 am cap automute 577.3 ?622.4 ana in inverting analog input 1449.4 ?622.4 ana in + noninverting analog input 1603.5 ?622.4 v cca (1) v cc analog power supply 1898.7 ?622.4 v ssa v ss analog power supply 1885.2 ?622.4 rac row address clock 1483.8 4623.7 int interrupt 794.8 4623.7 xclk external clock input 564.8 4623.7 v ccd2 v cc digital power supply 387.9 4623.7 v ccd1 v cc digital power supply 169.5 4623.7 sclk slave clock ?4.7 4623.7 ss slave select ?98.1 4623.7 mosi master out slave in ?063.7 4623.7 miso master in slave out ?325.6 4623.7 v ssd1 v ss digital power supply ?655.3 4623.7 v ssd2 v ss digital power supply ?836.9 4623.7
isd microtad-16m 23 isd ordering information when ordering isd microtad tm devices, please refer to the following valid part numbers. for the latest product information, access isd? worldwide website at http://www.isd.com. part number isd microtad-16me isd microtad-16mp isd microtad-16ms isd microtad-16mx product family isd microtad tm special temperature field: blank = consumer packaged (0?c to +50?c) or consumer die (0?c to +50?c) package type: e = 28-lead 8x13.4mm plastic thin small outline package (tsop) type 1 p = 28-lead 0.600-inch plastic dual inline package (pdip) s = 28-lead 0.300-inch plastic small outline package (soic) x = die isd part number description isd microtad 16m duration: 16m=16 minutes
a winbond company part no. isdmicrotadds1-599 2727 north first street san jose, california 95134 800/677-0769 (us only) tel: 408/943-6666 fax: 408/544-1787 http://www.isd.com important notices the warranty for each product of isd (information storage devices, inc.), is contained in a written warranty which governs sale and use of such product. such warranty is contained in the printed terms and conditions under which such product is sold, or in a separate written warranty supplied with the product. please refer to such written warranty with respect to its applicability to certain applications of such product. these products may be subject to restrictions on use. please contact isd, for a list of the current additional restrictions on these products. by purchasing these products, the purchaser of these products agrees to comply with such use restrictions. please contact isd for clarification of any restrictions described herein. isd, reserves the right, without further notice, to change the isd chipcorder product specifications and/or information in this document and to improve reliability, functions and design. isd assumes no responsibility or liability for any use of the isd chipcorder products. isd conveys no license or title, either expressed or implied, under any patent, copyright, or mask work right to the isd chipcorder products, and isd makes no warranties or representations that the isd chipcorder products are free from patent, copyright, or mask work right infringement, unless otherwise specified. application examples and alternative uses of any integrated circuit contained in this publication are for illustration purposes only and isd makes no representation or warranty that such applications shall be suitable for the use specified. the 100-year retention and 100k record cycle projections are based upon accelerated reliability tests, as published in the isd reliability report, and are neither warranted nor guaranteed by isd. this data sheet and any future addendum to this data sheet is (are) the complete and controlling isd chipcorder product specifications. in the event any inconsistencies exist between the information in this and other product documentation, or in the event that other product documentation contains information in addition to the information in this, the information contained herein supersedes and governs such other information in its entirety. copyright?1999, isd (information storage devices, inc.) all rights reserved. isd is a registered trademark of isd. chipcorder and microtad are trademarks of isd. all other trademarks are properties of their respective owners.

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